EVENT REPORTER

A BRIEF REPORT ON IPCA EXPO 2009 CO HOSTED WITH ELECTRONICA-PRODUCTRONICA INDIA 2009 DURING 8-11 SEPTEMBER 2009 IN BANGALORE INTERNATIONAL EXHIBITION COMPLEX

The IPCA Expo 2009 co hosted with electronic India 2008 was a leading trade fair for the electronic industry and in particular that for the Printed Circuit board industry, EMS and SMT with the participation of high quality of international and national exhibitors of Printed Circuit boards, allied materials and machinery for PCB fabrication, assembly, quality, machines for PCB wet processing, chemicals, raw materials, SMT equipments for manufacture  in its IPCA pavilion. We had on the whole 26 stalls, representing around 40 international manufacturers of machinery for PCB manufacture, assembly and testing, SMT, displaying their products and machinery in IPCA pavilion.

Electronica & Productronica India 2009 entered into a strategic partnership with IPCA and the response has been very encouraging. Mr. Anil Kumar, President of IPCA, expressed satisfaction on this strategic partnership between MMI India and IPCA and said, “We are very excited about this high-level cooperation with MMI India and this partnership is a positive step towards the interest of the industry.”

Over all the Show was excellent and beneficial to the progress and betterment of the PCB industry, electronic hardware industry and its entrepreneurs in our country. All together the show attracted over 10,300 visitors and about 4,600 focussed attendees and over 400 conference delegates, and especially with the participation of 15 Asian delegates who have attended our AFEC conference with their active participation and presentation of papers on market potential and technology innovations of the country of origin.

Electronica-Productronica India 2009, IPCA Expo co-hosting was befittingly inaugurated in a specially organised inaugural function, with lighting of the lamps by Mr. Klaus Dittrich, Managing Director, Messe Muenchen International, Germany, Mr. Kevin Yan, the Secretary General of WECC(WORLD ELECTRONIC CIRCUITS COUNCIL), China and IPCA President Mr. Anil Kumar in the presence of all dignitaries, exhibitors and visitors present for the function.  This ceremony of lighting the lamp was followed by the cutting of the Ribbon at the entrance of the Exhibition hall by all the WECC/AFEC members and the other dignitaries of Messe Muenchen present and the exhibition 2009 was declared open with its 500 exhibitors on display of electronic components, PCBoards, electronic hardwares,  SMT machinery and peripherals for manufacture and assembly.

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THE THIRD AFEC CONFERENCE HOSTED BY IPCA

The added importance and benefit for the show was the participation of all the leading Asian PCB manufacturing associations for the third AFEC (ASIAN FEDERATION OF ELECTRONIC CIRCUITS) Conference, hosted by IPCA to present the current production scenario of PCBs and the emerging technologies of PCB manufacture of the country of origin in respective countries. Apart from the presentations on Market potential and growth, IPCA being a member of the AFEC, for the first time in India was hosting the AFEC Conference on 8th and 9th of September, along with all its members present from CPCA, HKPCA, JPCA, KPCA and TPCA. The AFEC had its Working Committee meeting on the first day followed by  Market Potential and Technology conference for two days  with the cooperation and participation of  all Asian Printed circuit Associations for two days with delegates  from China, Taiwan, Hong Kong, Japan, Korea. The papers presented were on state-of-the art technology and recent innovations in the advanced technology of PCB manufacture around the globe, with key note addresses for respective sessions from experts in the field. The AFEC Conference on market-growth and & technology presentations paved way for new avenues, opportunities and challenges for the Asian PCB industries to explore new markets, new technologies for PCB/EMS and to grow together.

Added to the above we had a special session in the AFEC conference on UL India Certification details followed by very useful and interactive discussions emerged from among the members present on various issues pertaining to UL India certification procedures and policies. This session was specially addressed by Mr. Manish Bhatnagar, the Vice President of UL India.

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Electronica India and productronica India 2009
puts a smile back on the  face of the electronics industry

• Electronica and Productronica brands successfully debut into India on the occasion of the show’s 10th anniversary
• Over 15,300 high-level attendees ensure the success of the show
• CEO’s at conference attract industry leaders and experts

Bangalore, September 11, 2009: The 10th anniversary of India's number 1 electronics trade fair, electronica India and productronica India 2009, gave a boost to the Indian and international electronics industry.  Exhibitors across the spectrum of the electronics hardware and production technology were present under one roof at the trade fair held in Bangalore between September 8 and 11.

Over 825 exhibitors and represented companies from 25 countries were present in 2 halls at this spectacular event. Countries like Germany, Taiwan, Singapore and China had their own pavilions. Assembleon, Digital Circuits, EMST Marketing, Fuji, Hical, Kaynes, Komax,Leaptech, Murata, NMTronics, NXP Semiconductors, Rittal, Schleuniger, SLN Technologies, Sony, Sumitron, Toyota Tsusho and Truly were some of the leading electronics companies that displayed their state-of-the-art-technology.

Some of the highlights of electronica India and productronica India 2009 included:

• Sony Manufacturing Systems Corporation showcased six of their range of high-technology, environment-friendly chipmounters and printers for the first time in India
• SLN Technologies entered into a JV with a UK company, Fleetm8, for intelligent vehicle tracking and fleet management systems.
• For the first time in India, Yamaha Motor Co. Ltd. showcased a new mounter series that works with intelligent feeders.
• Murata Electronics Singapore Pte. Ltd., a component manufacturer, showcased its products in India for the first time.
• The Indian Printer Circuits Association (IPCA) launched IPC 600 and IPC 610 – a certification course for the EMS industry
• The Asia Federation of Electronic Countries (AFEC) held a 2-day seminar on ‘World Market and Trends’ which had representatives from countries like Japan, India, Korea, Hong Kong and Taiwan who participated.
• Agate & Agate Marketing Resources (I) Pvt. Ltd. brought an indigenous range of products in the SMT line including, a Solderplate Softener and PCB Storage Systems.
• SM Electronics Technologies Pvt. Ltd. launched wireless modules and a new range of LCDs.

A high number of electronics industry representatives used the show as an opportunity for networking and business transactions in a resurgent economy. All together the show attracted over 10,300 visitors and about 4,600 focussed attendees and over 400 conference delegates.    Mr. Klaus Dittrich, Managing Director, Messe Muenchen International stated, “The high volumes of trade visitors and atmosphere of this trade fair is of international standards and electronica India and productronica India is on its way to becoming one of the most anticipated shows in the electronics industry.”

"The successful debut of the world's leading electronics trade fair brands - electronica and productronica 2009 - amidst a resurgent Indian economy puts the smile back on the electronics industry's face. MMI India will do everything needed for the emergence of India's electronics industry as a strong player on the global scene", said Mr. Manmeet Sabarwal, Managing Director, MMI India.

Mr. Anil Kumar, President of IPCA, expressed satisfaction on the strategic partnership between MMI India and IPCA and said, “We are very excited about this high-level cooperation with MMI India and this partnership is a positive step towards the interest of the industry.”

Mr. Hiroshi Sudo, President, Sony Manufacturing Systems Corporation said, "India is a huge market for us and we have exhibited our machines here for the first time. We believe that our machines will offer the solutions that our Indian customers are looking for."

Mr. Yeo LC, Chief Representative, Murata Electronics Singapore (Pte) Ltd. said, “With adequate publicity for the show, we reach out to the right people. The response to the show has been better than we expected and we are glad to have participated.”

Mr. Amit Madan, Country Manager, TransTechnology India Pvt. Ltd. said, “Electronica India and Productronica India 2009 is the only platform that our industry has for showcasing its might. It is an enabling platform for both suppliers and customers.

Mr. KM Swaminathan, Sr, Business Manager, NMTronics India Pvt. Ltd. said, “Because of the recession and other factors, we were apprehensive about being able to justify our investment in the show. However, the response for electronica India and productronica India 2009 has led us to believe that our investment is safe and we have had several enquiries.”

Mr. MS Manjunath, SM Electronics Technologies Pvt. Ltd. said, “Electronica India and Productronica India 2009 have given us a good platform and opportunity to showcase our products.”

Two accompanying high profile conferences which took place simultaneously with electronica India and productronica India 2009 attracted participation from senior management. This demonstrates the growing importance of the trade fair and conferences also for CEO level. The panel discussion on the opening day from EMS/ OEM/s and ODM/s – with speakers from NOKIA, Moser Baer, SGS Tekniks, Reliance Infocom, Elcoteq, among others, ensured a very interesting exchange of information. The much awaited conference on Trends and Future requirements in Automotive Electronics, presented industry leaders from NXP Semiconductors, Wipro, KPIT Cummins, Robert Bosch and Tyco. Delegates from over 100 companies participated in each conference.

The next electronica India and productronica India will take place at the Bangalore International Exhibition Center from 7-10 Sept 2010.

Messe München International (MMI) is one of the world’s leading trade fair companies. It organizes around 40 trade fairs for capital goods, consumer goods and new technologies. Over 30,000 exhibitors from more than 100 countries and over 2 million visitors from more than 200 countries attend the events in Munich every year. MMI also organizes trade fairs in Asia, Russia, the Middle East and South America. With 6 subsidiaries abroad - in Europe and Asia – and 66 foreign representatives covering 89 countries, MMI has a truly global network.

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ELECTRONC SYSTEMS PACKAGING TECHNOLOGIES WORKSHOP HELD ON November 26-27, AT CHOKSI HALL, IISc BANGALORE BY IPCA-IISC

IPCA in technical association with CEDT, IISc conducted a two-day national workshop on the topic “Electronics systems packaging technologies” ESPT-09 at Choksi Hall, Indian Institute of Science, Bangalore between November 26-27, 2009. There were 45 registered attendees from various organizations representing public sector enterprises like BEL, ADE, LRDE etc and many from the private sectors including multinational companies like Intel, Bangalore.

The event was mainly organized to provide a platform where practicing engineers can understand the basics of electronic systems packaging and also provide an insight into the multidisciplinary areas of packaging over two days of interactive sessions, coordinated by Mr Mahesh G V, Principal Research Scientist, CEDT, IISc.

The workshop was inaugurated by the Chief guest, Prof. N.J. Rao and declared open with the lighting of the lamp.

Prof N J Rao a retired Professor of CEDT and an eminent educationist, also a Visiting Professor at IIIT-Bangalore, in his inaugural address mentioned about the dire need for packaging education in this country as also the requirement for good packaging text books for the practicing engineers and students, except for the curriculum and the specialized educations programme in systems packaging currently being offered at IISc.

Prof K Gopakumar, Chairman of CEDT, IISC & Mr Anil Kumar, President of IPCA presided over the function. While speaking on the occasion they emphasized the need for packaging in today’s electronic products like laptop and other similar miniaturized products which are growing in unimaginable dimensions in all its aspects.

Mr. Anil Kumar recollected how the training and special education from IISc he had during his younger days at IISc helped him to take the desired proficiency and in fact motivated him to move into electronics entrepreneurship in the later years. Extending again a warm welcome to all the delegates on IPCA’s behalf, he was specifically happy that IPCA is organizing workshops on latest development in electronic technologies with the help of IISc and in fact assured more such programs and hands on trainings will be held in the near future for the benefit of its members and other allied industrialists and students.

Dr Shankara K Prasad, CEO, Inkroma, Bangalore started off the technical sessions with an overview of packaging and more specifically dealt on SiP modules and stacked die. His talk included current global figures on the growth of IC packaging market in China and other SE Asian countries which are marching ahead in semiconductor packaging. His talk was followed by Dr Arun Chandrasekhar of Intel, Bangalore on the topic of Systems packaging challenges. The multidisciplinary area of systems packaging was highlighted including electrical and thermal issues for designers.

Prof G K Ananthasuresh of IISc gave a very elaborate and exciting talk on MEMS and MEMS packaging, embracing a lot of case studies and products in the areas pressure sensors, chemical and bio sensors during his discourse. The effect of packaging materials on MEMS devices’ electrical parasitics was clearly highlighted by him.

The the last talk for the day was by Mr SLN Murthy, CEO, Tessolve India, Bangalore, an expert on Signal integrity issues in packages.  covering all DFX issues.

The second days’ program began with Mr G V Mahesh of CEDT, IISc, speaking on board-level technologies and specially highlighting on current high-density interconnect structures including microvias, fine lines, and embedded passives. The ability of an FR4 package to accommodate advanced packages like BGA, CSP, bare die or C4 was explained to the delegates.

Mr Raghavendra of Aristos EMS Services, Bangalore delivered a presentation on SMT Assembly issues for fine-pitch components with the display of a few interesting video clips on SMT assembly defects aided by Mr. Mahesh.

Dr Venkat Natarajan of Intel spoke at length next, on all thermal issues at chip and board level. Modern methods of cooling was explained by him in detail.

Mr Richard Puthota of Cookson Electronics presented in great detail the practical aspects and problems that are usually faced in Reflow Soldering and Assembly of SMDs, evoking special interst and discussions among the especially on thermal profile settings and material selection for reflow soldering.

The last lecture for the workshop was on Quality Control during manufacturing and assembly by Mr Nagaraj Iyengar of Kaynes Technology, Mysore.

Many participants provided feed-back during the concluding session and expressed that in general the topics discussed were very relevant to the understanding of the subject. Certificates to the participants were then distributed by Mr Anil Kumar, President IPCA. The new logo of IPCA signifying IPCA’s commitment to Design, Manufacturing, Assembly and Training in electronicswas also unveiled on this occasion. 

The Workshop lecture materials are available for sale. Contact IPCA at ipca@ipcaindia.org

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HKPCA & IPC SHOW 2009, held at Shenzhen, China: Dec. 2-4

2009 International Printed Circuit & Electronics Assembly Fair
Closes with Expressions of Optimism for the Industry’s Future Prosperity
Tremendous Response with Record-breaking Booth Rebooking Rate

(Hong Kong, 17 December 2009)  Now in its eighth year, the 2009 International Printed Circuit & Electronics Assembly Fair (2009 HKPCA & IPC Show) reinforced its reputation as the flagship trade show for sourcing and technology exchange in Southern China for the PCB and EA industry.  The Fair resulted in an encouraging turnout, with 30,000 visits recorded despite the difficulties faced by the industry.  The Fair was successfully held at the Shenzhen Convention & Exhibition Center, China, from 2 to 4 December under the theme “Join Hands Leap Ahead”.

The emphasis of this year’s show, jointly organized by the Hong Kong Printed Circuit Association (HKPCA), the Association Connecting Electronics Industries (IPC) and the China Council for the Promotion of International Trade Guangzhou Sub-Council (CCPIT-GZ), was on building closer collaborative links throughout the supply chain to withstand the current market downturn and strengthen the industry in preparation for the expected economic recovery in 2010.  According to on-site surveys, visitors found the show an excellent forum for exchanging ideas and information, seeking out new business partners, developing fresh opportunities, and bringing themselves up to date on the latest technology and product trends. 

Visitors and Exhibitors Confident of Market Recovery
Visitors and exhibitors alike expressed optimism about the outlook for the industry next year, with general expectations of an upturn in demand.  More than 350 exhibitors, including such major names as Atotech, C Sun, Dow (formerly Rohm and Haas), Elec & Eltek, Han’s, Hitachi Via, Jadason, Kingboard, Meadville, Multek, Schmoll, Techwise, Vega, WKK, World Wide and many more, made the show a sellout for the second consecutive year, with over 1,000 booths being rebooked for 2010 during the show days. Mr. Viral Bhulani, immediate past President of IPCA &, CMD of Omega India, represented IPCA in the Show and participated in all the functions, conferences and meetings.

In on-site interviews, exhibitors were strongly appreciative of the show’s value as a platform to interact with clients and industry participants.  Mr. Francis Tsoi, President of World Wide, commented that “the show helps us to increase awareness and to promote our products”.  He predicts positive growth in China for the next 3 to 5 years, with an ample supply of talent, equipment & resources.  Mr. Hamed El-Abd, Executive Director of WKK, remarked that he was happy to be at the show again as it helps his company find right and new customers.  He expects future development of the PCB industry in China to be good as everyone in the world now looks to China, where it is easy to manufacture as everything is readily available at a competitive price.

International Technical Conference Looks to Successful Future

Focusing on Market, Technology and Collaboration as the three keys to the success of the PCB industry, the concurrent International Technical Conference also looked towards a brighter future. China’s expanding domestic market was stressed by several Conference speakers as the key to future industry growth.  Mr. Anthony Hilvers, Vice President of Industry Programs, IPC, pointed out that China was now the world’s largest PCB producer, while Mr. H.W. Kong, Honorary Chairman of the HKPCA, highlighted opportunities arising from the country’s move to 3G telephony and growing demand for electronic products, saying that: “PCB manufacturers with a sound financial position, wide product range, quality products and professional services will have a higher chance to reap the benefits owing to their close-to-market advantage”.  Mr. Eric Fung, HKPCA Vice-Chairman, reinforced this message, pointing to favorable Chinese government policies, and also stressed the importance of other developing markets.

2010 Show to Highlight Growth Opportunities
The recovering market, and particularly the growth of demand in China, will set a positive tone for the 2010 PCB and EA Fair, under the theme “Inspiration, Integration, Progression”.  The Fair, which will again be held at the Shenzhen Convention & Exhibition Center from 1 to 3 December 2010, will focus on the new growth opportunities opened up by market recovery following the consolidation period of the past year. 

For more information on the show, please visit www.hkpca-ipc-show.org.

About HKPCA

Established since 2000, the HKPCA is a Hong Kong-based trade association dedicated to promoting and protecting the rights and interests of its member companies in the printed circuit industry. As the number of PCB manufacturers in China continues to grow, HKPCA organizes technical/business seminars, training courses, conferences and exhibitions in Hong Kong and mainland China on a regular basis to help members and other industry players to sustain their growth. For more information, please visit www.hkpca.org

About IPC

IPC is a global trade association based in Bannockburn, Ill., USA, dedicated to the competitive excellence and financial success of its 2,700 member companies, which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and testing. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.7 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; Moscow, Russia; and Shanghai and Shenzhen, China. For more information, please visit www.ipc.org

About CCPIT-GZ
CCPIT-GZ was established in 1985. Over the past 20 years, CCPIT-GZ has been abiding by the principle of promoting international trade and cooperation, in addition to enhancing international communication and friendship. CCPIT-GZ has successfully organized numerous trade shows and provided other services including authentication of export documents, training, information, consultation, mediation and arbitration of business disputes. For more information, please visit http://guangzhou.ccpit.org

(Courtesy: Press release from HKPCA)

( A few photographs attached)

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Event Manager -- e21 MagicMedia

ELECTRONICS DESIGNERS COUNCIL OF INDIA, A DESIGN WING OF IPCA, CONDUCTED ITS SIXTH CID CERTIFICATION COURSE ON PCB DESIGN TO IPC STANDARDS : December 10-12 in Bangalore

 The sixth course of CID (Certified Interconnect Designer) workshop and Exam was conducted at Bangalore from 10-12 Dec 2009 at NITTTR conference facility by EDCI (Electronics Designers' council of India). The course was Tutored by Mr.Will Gilman of USA, an IPC Designers Council approved Instructor and was attended by 14 Designers from various Private and Public enterprises like GE, L&T, ISRO, Alpha-Imager, Visionics. Now we have over 100 designers certified as CID in india delivering quality design services to international customers. Certification has enabled companies to earn valuable overseas contracts. EDCI thank IPCA and IPC designers council for their support and encouragement. Special Thanks to Mr. Gilman for making the trip from USA to conduct this workshop. NITTTR provided the conference facility and helped conduct the workshop and we thank the Professor & Head and faculty for their support.

For future courses on CID certification please contact at email: thiyaga@nuelineindia.com; sunitha@alphaimager.com

M.Thiyagarajan
Executive Director
EDCI

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