To promote learning and to advance education in the science and application of electronic packaging namely printed Circuit and Inter-connection Techniques.
To conduct educational training programme on PCB technology for the interested by arranging systematic courses to such trainees with the help of recognised institution/industry, thus enabling IPCA to offer trained manpower to the PCB industry with a request to the Government to introduce interconnect technology as a regular faculty in technical courses
To extend increase and disseminate knowledge of Printed Circuit and interconnection Techniques, for which purpose meetings may be held, training and demonstrations given, exhibitions and conferences promoted, papers pamphlets, journals and other related writings published.
To collect and preserve literature, documents, recording or other writings whether published or not, any equipments or finished product which the committee may consider desirable to retain, and to make them available for reference, thereby to assist the knowledge, development and improvement of the science and application of Printed Circuit and interconnection techniques.
To affiliate or join in association with any other charitable body, institution of professional society holding similar interest and objectives whether in India or abroad.
To maintain awareness of and where appropriate, co-operate in the activities of professional societies concerned with related electronic engineering technologies,
for example, Hybrid and Microelectronics, semiconductor technology etc.
To uphold the good standing of the association and conduct its affairs in accordance with its Constitution as it is or later amended.
To do all of such other lawful things as are incidental or conductive to the attainment of the above objectives.
To form a steering Sub-committee called "Technology / Market Research council" consisting of representatives of manufacturers, users and suppliers representing the industry.
To institute awards / felicitations by IPCA to recognise outstanding contribution in the field of Technology of Printed Circuits. The nominations for such awards will be received, scrutinised and recommended by the Executive Committee.
