IPC, USA: Test your knowledge. Take a fresh Quiz on IPC-A-610E solder joint criteria
(Visit: http://ipctraining.org/promo/html/newformat/solder criteria)Contact for details: director@ipcvideo.org
IPC, USA releases PB industry results for September 2010, along with the 09-10 BOOK-TO-BILL graphs.
(pl. see the attachments for the report and the graph)
IPC New Release – New IPC Training and Reference Media
Media Training & Reference Guides for the latest IPC-A-610
— Now Updated to Revision E —
IPC media training resources include new books, posters, DVDs and online videos for your learning network... everything you need to train, reference and test your employees to the latest surface mount and through hole solder joint acceptance criteria from the new Revision E of the IPC-A-610 and J-STD-001 standards.
DVD-SMT-E and DVD-PTH-E
Our updated training videos on Surface Mount and Through Hole Solder Joint Evaluation are designed for unlimited students in the classroom, with free paper-based testing and IPC Training Certification Certificates. Also includes Free E-Testing. DVD menu controls allow for selection of Class 2 or 3 requirements. Also includes English subtitles for hearing-impaired and ESL (English-as-Second-Language) students. A quick and effective way to make sure your employees understand the latest IPC-A-610E solder joint acceptance requirements.
OVT (Online Video Training)
versions of these new training videos are available for self-paced, computer-based learning on your own network / intranet — in both site and global licenses. OVTs include free DVDs when you prefer classroom training. Online videos are licensed for integration into your company's Learning Management System. The OVT format also includes free paper and/or E-Testing options.
IPC Media training provides fast, effective and documented training for ISO-9001:2008 requirements.
Training and Reference Guides
Our training and reference guides offer an easy-access compilation of the critical solder joint requirements from IPC-A-610E and J-STD-001E... for both surface mount and through hole acceptance criteria. (For product classes 1,2 & 3) These 30+ page, full-color manuals also highlight the important changes from Rev. D to Rev. E criteria. Convenient for both training and reference.
Wall Posters
Large 20x28" full color wall posters are a great way to reinforce the latest solder joint requirements... in the training room or on the production floor. The new posters also highlight the changes from Rev D to Rev E for Class 2 and 3.
Try before you buy!
All of these new videos, guides and posters include free and complete online reviews. Choose from the links below to view online... or register for a free Demo DVD Catalog, to be sent to you through the mail. Please contact us if you have any questions... we're here to help.
DVD-PTH-E Through Hole Solder Joint Evaluation
Content description, pricing, order info and free online review
DVD-SMT-E Surface Mount Solder Joint Evaluation
Content description, pricing, order info and free online review
DRM-PTH-E Through Hole Solder Joint Evaluation - Training and Reference Guide
Content description, pricing, order info and free online review
DRM-SMT-E Surface Mount Solder Joint Evaluation
Training and Reference Guide Content description, pricing, order info and free online review.
PTH Posters Surface Mount Solder Joint Evaluation - Training and Reference Guide
Class 2 - Order info and free review
Class 3 - Order info and free review
SMT Posters Surface Mount Solder Joint Evaluation - Training and Reference Guide
Class 2 - Order info and free review
Class 3 - Order info and free review
DVD Catalog
Register for a free DVD Demo Catalog sent to you through the mail.
Watch our brief & informative movie
explaining IPC Media Training.
View More Details
Dear Colleague;
As an IPC member, you are entitled to a free download of our new World PCB Production Report. For many years, it was available only to a subset of members who paid additional dues for market research. Now it is available free to all IPC members as a benefit of membership. This valuable report is the product of many months' work by a committee of the world's top industry analysts. It offers consensus estimates of printed circuit board production value by country and by specific product type, as well as commentary on trends in the industry and historical data.
The report is not for sale to the industry. This link will take you to a log-in page and then to the report: http://www.ipc.org/World-Report-2009 . If you don't remember your IPC user name and/or password or if you need to create a password, the log-in page will provide instructions. With your password, you can access everything in IPC's members-only area, including a wealth of market research reports and conference proceedings.
After you've perused the report, we would appreciate your feedback, which will help us make improvements in next year's report. This link will take you to a World Report user survey: www.surveymonkey.com/s/MM2YQM7.
Please feel free to contact me if you have any comments or questions.
Best regards,
Sharon Starr
Director of Market Research
IPC — Association Connecting Electronics Industries®
3000 Lakeside Drive
Suite 309 S
Bannockburn, IL 60015-1249 USA
+1 847-597-2817 tel
+1 847-597-2845 fax
SharonStarr@ipc.org
www.ipc.org
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“PCB World Production & Market” An article by Dr. Hayao Nakahara, N.T.Information Ltd, NTI Digest, March 2010
“2009 was one of the worst recessionary years since the end of World War II. Subprime problem in the US, which looked innocent to most other countries, spread quickly throughout the world like a contagious disease, particularly after the fall of Lehman Brothers in September of 2008. China was the only major country that was spared from this terrible recession, but because of its excessive stimulus programs, there are fears of inflation and rising wages. Its outcome is yet to be seen.
Certain areas of electronics industry, such as Flat Panel TV (FPTV), Cell Phones (CP) and Personal Computers (PC), did not do too badly in 2009 despite the recession, at least in terms of the number of shipment although considerably down when measured in revenue.
We shall analyze the outcome of our electronics industry during the recessionary year of 2009 and attempt to forecast for the near future”. Dr. Nakahara
More Details: 
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INDIA RANKED SECOND IN GLOBAL MANUFACTURING COMPETENCE
India has been ranked second, ahead of the US and South Korea, in terms of manufacturing competence globally, a repot by Deloitte has said. China, followed by Indian and South Korea has been ranked first, second and third respectively in the 2010 global manufacturing competitiveness index; a result of the collaboration between Deloitte Touche Tohmatsu and the US council on competitiveness.
“In less than a decade, a new world order for manufacturing competitiveness has emerged along with a tectonic shift in regional manufacturing competence”, the report said.
The rise in the manufacturing competitiveness of three countries in particular -- China, India, and the republic of Korea -- appears to parallel the rapidly growing and important Asian market,” said the 56-page report. The report notes that China’s ascent to the top of the list is not surprising, given its rising eminence in the manufacturing sector over the past ten years, particularly as a regional hub for foreign outsourced production, foreign direct investments, and joint ventures.
“Perhaps more surprising is that India is now positioned at number two and gaining an even stronger foothold on that position over the next five years”, the report said, adding India’s rich talent pool of scientists, researchers, and engineers as well as its large, well-educated English-speaking workforce and democratic regime make it an attractive destination for manufacturers.
Noting that since the mid-1990s, India’s software industry has escalated to new heights and post-economic libration has also opened a pathway to unprecedented market opportunities for Indian manufacturing, it said moreover, beyond low-cost, Indian manufacturers gained experience in quality improvement and Japanese principles of quality management, with the largest number of deeming award winners outside of Japan.
“The country is also rapidly expanding its capabilities in engineering design and development and embedded software development, which form an integral part of many modern-day manufactured products,” it said. The importance of India to manufacturing executives around the world underscores two important points, it said.
Under the current competitive index China tops the ranking with the maximum 10 points, followed by India (8.15), South Korea (6.79), the US (5.84), Brazil (5.41) and Japan (5.11). First, strength in research and development, paired with engineering, software, and technology integration abilities, are viewed by global executives as a vital element of the talent-driven and innovative manufacturing enterprise of the 21st century.
“Second, manufacturing executives increasingly view India as a place where they can design, develop and manufacture innovative products for sale in local as well as in global markets,” the report said.
“These factors explain, in part, India’s rise form a low-cost, ‘back office’ location to a country that is well-positioned to be an active participant in the entire value chain, as well as it now being viewed by many executives as an integral part of their global manufacturing enterprise and location strategy,” the report said.
THE ECONOMIC TIMES BANGALORE MONDAY 12 JULY,2010
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IPC MEMBER BENEFITS UPDATE New Resources for IPC members for updating on technology-publications from IPC, USA
Dear Valued Member,
IPC membership is an important business tool that offers invaluable educational, networking and marketing opportunities and provides access to industry standards, technical papers and relevant, timely presentations. Many member benefits are available free of charge and available on the IPC Web site. In today's economy, it makes good business sense to use all the free benefits of your IPC membership.
To ensure that you are fully up-to-date on free access to new or updated standards, research, presentations, white papers and more, the IPC membership team is pleased to provide you with the following information, current to June 2, 2010. Member log-in will be required.
All resources listed below are available to you at no charge as a benefit of membership.
MARKET RESEARCH
Electronics Industries Market Data Update (Spring, 2010) (.pdf)
ENVIRONMENT – WHITE PAPER
Recasting the RoHS Directive - An Opportunity to Solidify its Scientific Basis in Support of Comprehensive
Environmental Regulation (.pdf)
AUDIO/VIDEO PRESENTATIONS – Online Presentation Library
Technology Presentations (IPC APEX EXPO™ 2010, April 6-8, 2010)
Telecommunications Case Studies Address Head-in-Pillow (HnP) Defects and Mitigation through Assembly Process Modification and Control
Characterizing the Lead-free Impact on PCB Pad Craters
Progress in Developing Industry Standard Test Requirements for Pb-Free Solder Alloys
Challenges in Reflow Profiling Large & High Density Ball Grid Array (BGA) Packages Using Backward Compatible Assembly Processes
The Lean SMT Line
Lead-Free Processing Session from IPC APEX EXPO – (APEX10-S35)
Synchronized slides and audio from all three presentations from Session 35 on Lead-Free Processing
Telecomm Head-in-Pillow Case Study – (APEX10-S15)
This paper received the Best Paper U.S. Honorable Mention award. This package includes synchronized slides and audio.
Management Presentations (IPC APEX EXPO™ 2010, April 6-8, 2010)
Are the Consequences of Industry Consolidation Good or Bad?
How Does Cost Accounting Impact Pricing?
High Brightness LEDs: Opportunities, Technologies and Challenges
PROCEEDINGS PAPERS
2010 IPC APEX EXPO™
Proceedings Papers, Free Forums and Posters – all in .pdf format
NEW STANDARDS – FREE
IPC members may request a free single user download of a document (one language only) with digital rights management of each new standard by sending an e-mail to MemberTechRequests@ipc.org within 90 days.
IPC/JEDEC – Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-Free) and Other Attributes – (J-STD-609A)
This standard provides a marking and labeling system that aids in assembly, rework, repair and recycling and provides for the identification of:
- those assemblies that are assembled with lead-containing or lead-free solder
- components that have lead-containing or lead-free second level interconnect terminal finishes and materials
- the maximum component temperature not to be exceeded during assembly or rework processing
- the base materials used in the PCB construction, including those PCBs that use halogen-free resin
- the surface finish of PCBs
- the conformal coating on PCBAs
New to this revision are additional codes for the more precise specification of certain lead-free solders. Released February, 2010.
Generic Requirements for Electronic Product Documentation – IPC-2611
This standard establishes the generic requirements for a document set describing electronic products, and the methodology used for revision control and configuration management of the information. The generic descriptions apply to the entire document set and are used to define and maintain the electronic product. The methodology permits different grades of completeness of the documentation, as well as identifying the various products, packaging and interconnection techniques for which unambiguous documentation is required. The requirements pertain to both hard copy and electronic data descriptions. Released March, 2010.
Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions) – IPC-2612
This standard establishes the requirements for the documentation of electronic diagrams used as the foundation for defining the electrical interconnectivity of electronic products. The description pertains to either schematic diagrams, logic diagrams or Boolean truth tables and includes methodology for defining circuit flow, electrical or functional restrictions, or maintenance test procedures used to design or maintain the electronic product. The requirements pertain to hard copy, electronic copy or electronic data descriptions Released March, 2010.
Sectional Requirements for Electronic Diagramming Symbol Generation Methodology – IPC-2612-1
This standard establishes the requirements for generation of electronic symbols used in the documentation of electronic diagrams that define the electrical interconnectivity of electronic products. The descriptions pertain to schematic symbols, logic symbols or Boolean truth tables required to define the circuit configuration. Where appropriate, the standard also includes methodology for defining circuit flow, electrical or functional restrictions, or maintenance test procedures used to design or maintain the electronic product. The requirements pertain to both hard copy and electronic data descriptions. Released March, 2010.
Sectional Requirements for Board Fabrication Documentation – IPC-2614
This standard establishes the requirements for the documentation of printed circuit board fabrication, and identifies the physical attributes and performance requirements of the unpopulated product. The descriptions apply to rigid, flexible, inorganic substrates or any combination thereof. The construction may be single, double, multilayered, or HDI technology and may include embedded (integrated) components. The requirements pertain to both hard copy and electronic data descriptions. Released March, 2010.
Manufacturing Process Data Management – (IPC-1756)
The IPC-1756 standard applies to products, components, subproducts and materials that are supplied to producers of electrical and electronic components for incorporation into their products. It covers assembly materials and manufacturing data in order to facilitate and identify the process sensitivity of the products, components and subproducts. The standard establishes 23 fields for declaration of manufacturing data. These fields are supported by Scriba and other tools developed between users and suppliers. The data descriptions incorporate the requirements of IPC-1751 for generic company information. As such, the IPC-1751 becomes a mandatory part of this standard and all conditions apply to the characteristics of the data structure as defined by the XML schema and the Scriba data capture tool. Released March, 2010.
Flexible Base Dielectrics for Use in Flexible Printed Circuitry – (IPC-4202A)
This document provides comprehensive data to help users more easily determine both material capability and compatibility for flexible base dielectric materials for manufacture of flexible printed circuitry and flexible flat cables. It includes flexible base material specification sheets that have been updated with the newest properties for the specification material types. It establishes the most current classification system, qualification and quality conformance requirements, including high frequency dielectric properties. Released April, 2010.
Acceptability of Electronic Assemblies – (IPC-A-610E)
IPC-A-610 is the most widely used electronics assembly standard in the world. A must for all quality assurance and assembly departments, IPC-A-610E illustrates industry-accepted workmanship criteria for electronics assemblies through full-color photographs and illustrations. Topics include flex attachment, board in board, part on part, lead free, component orientation and soldering criteria for through-hole, SMT (new termination styles) and discrete wiring assemblies, mechanical assembly, cleaning, marking, coating, and laminate requirements.
IPC-A-610 is invaluable for all inspectors, operators and trainers. Revision E has 809 photos and illustrations of acceptability criteria-165 of them new or updated. This revision has been critically reviewed for clarity and accuracy. The document synchronizes to the requirements expressed in other industry consensus documents and is used with the material and process standard IPC J-STD-001. Released April, 2010.
Requirements for Soldered Electrical and Electronic Assemblies – (IPC J-STD-001E)
J-STD-001E is recognized worldwide as the sole industry-consensus standard covering soldering materials and processes. This revision includes support for lead free manufacturing, in addition to easier to understand criteria for materials, methods and verification for producing quality soldered interconnections and assemblies. The requirements for all three classes of construction are included. Full color illustrations are provided for clarity. This standard fully complements IPC-A-610E. Released April, 2010.
Acceptability of Printed Boards – (IPC-A-600H)
The definitive illustrated guide to printed circuit board acceptability! This four-color document provides photographs and illustrations of the target, acceptable and nonconforming conditions that are either internally or externally observable on bare printed boards. Make sure your operators, inspectors, and engineers have the most current industry consensus information. With over 90 new or revised photographs and illustrations, revision H provides new coverage on topics such as copper wrap plating, copper cap plating of filled holes, and hole wall/barrel separation along with updated and expanded coverage for measling of printed boards, delamination and haloing, laminate voids/cracks, etchback, blind and buried via fill, and flexible circuits. The document sychronizes to the acceptability requirements expressed in IPC-6012C and IPC-6013B. Released April, 2010.
Qualification and Performance Specification for Rigid Printed Boards – (IPC-6012C)
This specification covers qualification and performance of rigid printed boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance as well as electrical, mechanical and environmental requirements. Revision C incorporates many new requirements in areas such as selection for procurement, new surface finishes, hole plating thickness, measling, weave exposure, copper cap plating of filled holes, laminate cracks and voids, etchback, blind and buried via fill, acceptance testing and frequency, and requirements for thermal stres testing. This revision synchronizes to the IPC-A-600H. For use with IPC-6011. Supersedes IPC-6012B with Amendment 1. Released April, 2010.
Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices – (J-STD-033B-CN)
Provides Surface Mount Device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive SMDs. Translation released May, 2010.
Standard for Determining Current Carrying Capacity in Printed Board Design – (2152-DE) German Translation
The sole industry standard for determining appropriate internal and external conductor sizes on printed boards as a function of the current carrying capacity required and the acceptable conductor temperature rise. This document provides guidance on how thermal conductivity, vias, copper planes, power dissipation and printed board material and thickness all factor into the relationship between current, conductor size, and temperature. Translation released May, 2010.
In order to access information, remember to log in to the Members Only Web site at www.IPC.org/Members-Only. For additional assistance, contact Susan Storck, IPC membership manager, at +1 847-597-2872 or SusanStorck@ipc.org or Jan Bakota, IPC membership coordinator, at +1 847-597-2809 or JanBakota@ipc.org.
Best regards,
Neal Bender
Director of Membership
3000 Lakeside Drive, Suite 309S, Bannockburn, IL 60015
Please contact IPCA for procurement of specs and other technology documents
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Email newletter of Bangalore Chamber of Industry & commerce
invites us to
refer to their Fifth issue (May 2010) of the Chamber’s e-Newsletter for “Overseas Business Opportunities” as given below.
View the issue by logging on to the link: http://www.bcic.org.in/newsletter/may2010/index.html for more details on collaboration to
New business opportunities to countries like Belgium, Japan, Asean countires, Australia, Malaysia and other countries listed.
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Global PCB Top 20
Walt Custer from Custer Consulting Group has presented the top 20 companies within the global Printed Circuit Board industry.
Walt Custer presented the study during his business outlook for the electronics industry at the IPC Apex Expo held in Las Vegas last week.
Source: Custer Consulting Group
http://www.custerconsulting.com/
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Germany and Finland lead European innovation growth
Source: Colin Holland, EETimes, March 29 2010 www.electronics-eetimes.com
The ninth edition of the European Innovation Scoreboard (EIS), which provides a comparative assessment of the innovation performance of EU27 Member States, under the EU Lisbon Strategy, shows that Denmark, Finland, Germany, Sweden and the UK are the innovation leaders. These countries have innovation performance well above that the EU27 average and all other countries. Of these countries, Germany and Finland are improving their performance fastest while Denmark and the UK are stagnating.
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China, India adding to e-waste: UN
“Sales of electronic products in countries such as China and India and across continents such as Africa and Latin America are set to rise sharply in the next 10 years,” the UN Environment Programme (UNEP) said in a report. “And unless action is stepped up to properly collect and recycle materials, many developing countries face the spectre of hazardous e-waste mountains with serious consequences for the environment and public health. The report, entitles “Recycling from E-waste to Resources” was released at a meeting of Bansel Convention and other world chemical authorities prior to the UNEP’s Governing Council meeting in Bali, Indonesia. “China is not alone in facing a serious challenge. India, Brazil, Mexico and others may also face rising environmental damage and health problems if e-waste recycling is left to the vagaries of the informal sector.” China already produces an estimated 2.3 million tones of e-waste, second only to the US with about three million tones, the report said. Global e-waste generation is growing by about 40 million tones a years.
- Business Line Delhi, February 23, 2010 (CETMA NEWS APRIL- 2010)
